"THE NEXT GENERATION OF AI: POWERING MOBILITY AND INNOVATION"
Programme Highlight
Join us at the Hong Kong Electronics Symposium 2026 to explore “The Next Generation of AI: Powering Mobility and Innovation.” We will gather leading experts from Chinese Mainland and overseas to share insights on how AI is transforming transportation, smart infrastructure, and industrial systems – an excellent opportunity to connect, learn, and be part of the future of intelligent innovation. This year’s program will highlight emerging applications that are reshaping global mobility trends. Attendees can also engage with innovators driving forward next‑generation sustainable and smart technologies.
| Organiser: | HKIE Electronics Division |
| Supported by: | CIE Hong Kong |
| Date: | 11 May 2026 (Mon) |
| Time: | 9:00am to 5:00pm |
| Mode: | Physical attendance |
| Venue: | Grand Ballroom, Royal Plaza Hotel, Mongkok |
| Registration: | https://docs.google.com/forms/d/e/1FAIpQLSfDlo_jN3tkbPhPBplq1uGZcABHKoPxv0zZQwdKsFG2TI4pUw/viewform?usp=header&pli=1&authuser=0 |
| Fees: | EARLY BIRD on or before 24 April, 2026 MEMBER: HK$800 NON-MEMBER: HK$1000 STANDARD MEMBER: HK$1300 NON-MEMBER: HK$1500 |
Registration & Enquiries
For information, please visit website http://www.en.hkie.org.hk. For registration, please complete the online Enrolment Form at END website https://docs.google.com/forms/d/e/1FAIpQLSfDlo_jN3tkbPhPBplq1uGZcABHKoPxv0zZQwdKsFG2TI4pUw/viewform?usp=header&pli=1&authuser=0. Successful applicants will be notified before the event. For enquiries, please contact Jacky LIANG at email [email protected] . Attendance certificate will be awarded by email after the seminar.
