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SUMMARY:Hong Kong Electronics Symposium 2026
UID:http://127.0.0.1/hong-kong-eletronics-symposium-2026/
LOCATION:Grand Ballroom, Royal Plaza Hotel, Mongkok
DTSTAMP:20260511T090000
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DESCRIPTION:"THE NEXT GENERATION OF AI: POWERING MOBILITY AND INNOVATION"
Programme Highlight
Join us at the Hong Kong Electronics Symposium 2026 to explore “The Next
Generation of AI: Powering Mobility and Innovation.” We will gather
leading experts from Chinese Mainland and overseas to share insights on how
AI is transforming transportation, smart infrastructure, and industrial
systems - an excellent opportunity to connect, learn, and be part of the
future of intelligent innovation. This year’s program will highlight
emerging applications that are reshaping global mobility trends. Attendees
can also engage with innovators driving forward next‑generation
sustainable and smart technologies.
Organiser:HKIE Electronics DivisionSupported by:CIE Hong KongDate:11 May
2026 (Mon)Time:9:00am to 5:00pmMode:Physical attendanceVenue:Grand
Ballroom, Royal Plaza Hotel,
MongkokRegistration:https://docs.google.com/forms/d/e/1FAIpQLSfDlo_jN3tkbPhPBplq1uGZcABHKoPxv0zZQwdKsFG2TI4pUw/viewform?usp=header&pli=1&authuser=0Fees:EARLY
BIRD on or before 24 April, 2026MEMBER: HK$800NON-MEMBER:
HK$1000STANDARDMEMBER: HK$1300NON-MEMBER: HK$1500
Registration & Enquiries
For information, please visit website http://www.en.hkie.org.hk. For
registration, please complete the online Enrolment Form at END website
https://docs.google.com/forms/d/e/1FAIpQLSfDlo_jN3tkbPhPBplq1uGZcABHKoPxv0zZQwdKsFG2TI4pUw/viewform?usp=header&pli=1&authuser=0.
Successful applicants will be notified before the event. For enquiries,
please contact Jacky LIANG at email hkieelectronicsdivision@gmail.com .
Attendance certificate will be awarded by email after the seminar.
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